Advanced Electronic Packaging Industry and Market Trends Analysed in New Report
Report Buyer, the online destination for business intelligence for major industry sectors, has added a new market report
According to the report “Advanced Electronic Packaging: International Technology and Market Trends” available at http://www.reportbuyer.com/go/BMR00009 with the burgeoning demand for portable devices, demand for advanced electronic packaging for accommodating the integrated circuits that support the aforesaid devices is on rise. Decreasing device size demands low cost electronic packages that are capable of rendering high speed, finer pitch, and higher pin count and reliable interconnects. Despite the fact that higher pin count increases cost, manufacturers are finding ways to deliver the most cost effective advanced electronic packages to address the needs of the industry.
The 191 page report states that the advanced electronic packaging industry has grown to a position where its technology has outpaced the semiconductor technology, the parent industry it addresses. Increasing silicon complexity and integration has made it mandatory for packaging technology to provide finer lead pitch, higher I/O counts, improved heat dissipation, and rapid, reliable interconnect. Simultaneously, the industry is also pushing towards decreased printed circuit board area and complexity, which is exerting further pressure on packaging requirements.
The report “Advanced Electronic Packaging: International Technology and Market Trends” is available from Report Buyer at:
http://www.reportbuyer.com/computing_electronics/electrical_components/advanced_electronic_packaging.html
Report Buyer product ID: BMR00009
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